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Functional Verification for Agile Processor Development: A Case for Workflow Integration 期刊论文
JOURNAL OF COMPUTER SCIENCE AND TECHNOLOGY, 2023, 卷号: 38, 期号: 4, 页码: 737-753
作者:  Xu, Yi-Nan;  Yu, Zi-Hao;  Wang, Kai-Fan;  Wang, Hua-Qiang;  Lin, Jia-Wei;  Jin, Yue;  Zhang, Lin-Juan;  Zhang, Zi-Fei;  Tang, Dan;  Wang, Sa;  Shi, Kan;  Sun, Ning-Hui;  Bao, Yun-Gang
收藏  |  浏览/下载：6/0  |  提交时间：2024/05/20
functional verification  agile development  open-source hardware  workflow integration  
社交知识图谱研究综述 期刊论文
计算机学报, 2023, 卷号: 46, 期号: 2, 页码: 304
作者:  江旭晖;  沈英汉;  李子健;  王元卓;  尹芷仪;  沈华伟
收藏  |  浏览/下载：6/0  |  提交时间：2024/05/20
social knowledge graph  social network  knowledge graph  knowledge reasoning  graph representation learning  knowledge extraction  graph integration  社交知识图谱  社交网络  知识图谱  知识推理  图表示学习  知识抽取  网络融合  
Taming Process Variations in CNFET for Efficient Last-Level Cache Design 期刊论文
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2022, 卷号: 30, 期号: 4, 页码: 418-431
作者:  Xu, Dawen;  Feng, Zhuangyu;  Liu, Cheng;  Li, Li;  Wang, Ying;  Li, Huawei;  Li, Xiaowei
收藏  |  浏览/下载：30/0  |  提交时间：2022/12/07
CNTFETs  Delays  Transistors  Layout  Very large scale integration  Radio frequency  Energy consumption  nanotube field-effect transistor (CNFET)  last-level cache (LLC)  process variation (PV)  variation-aware cache  
A Chip-Level Optical Interconnect for CPU 期刊论文
IEEE PHOTONICS TECHNOLOGY LETTERS, 2021, 卷号: 33, 期号: 16, 页码: 852-855
作者:  Hao, Qinfen;  Qin, Mengyuan;  Qi, Nan;  Xue, Haiyun;  Han, Meng;  Li, Xiaolin;  Hao, Kai;  Niu, Xingmao;  Xiao, Limin;  Fan, Dongrui;  Kurata, Kazuhiko
收藏  |  浏览/下载：44/0  |  提交时间：2021/12/01
Integrated optics  Optical interconnections  Transceivers  Adaptive optics  Optical switches  Optical sensors  Power demand  Optical interconnections  digital integrated circuits  very high speed integrated circuits  chip scale packaging  system integration  
Adaptive Kalman filtering-based pedestrian navigation algorithm for smartphones 期刊论文
INTERNATIONAL JOURNAL OF ADVANCED ROBOTIC SYSTEMS, 2020, 卷号: 17, 期号: 3, 页码: 14
作者:  Yu, Chen;  Luo, Haiyong;  Fang, Zhao;  Qu, Wang;  Shao, Wenhua
收藏  |  浏览/下载：52/0  |  提交时间：2020/12/10
Pedestrian navigation  error model system  inertial sensors integration  magnetic field  heading estimation  
Learning Coupled Convolutional Networks Fusion for Video Saliency Prediction 期刊论文
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS FOR VIDEO TECHNOLOGY, 2019, 卷号: 29, 期号: 10, 页码: 2960-2971
作者:  Wu, Zhe;  Su, Li;  Huang, Qingming
收藏  |  浏览/下载：285/0  |  提交时间：2019/12/10
Video saliency  feature integration  fully convolutional network  
Object Tracking Using Multiple Features and Adaptive Model Updating 期刊论文
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2017, 卷号: 66, 期号: 11, 页码: 2882-2897
作者:  Hu, Qingyong;  Guo, Yulan;  Lin, Zaiping;  An, Wei;  Cheng, Hongwei
收藏  |  浏览/下载：62/0  |  提交时间：2019/12/12
Adaptive model updating  correlation filters  multiple feature integration  object tracking  
Geometry-based propagation of temporal constraints 期刊论文
INFORMATION SYSTEMS FRONTIERS, 2017, 卷号: 19, 期号: 4, 页码: 855-868
作者:  Li, Zhaoyu;  Xu, Rui;  Cui, Pingyuan;  Xu, Lida;  He, Wu
收藏  |  浏览/下载：42/0  |  提交时间：2019/12/12
Internet of Things (IoT)  Information integration  Temporal constraints  2-dimensional space  Geometric method  
An industrial information integration approach to in-orbit spacecraft 期刊论文
ENTERPRISE INFORMATION SYSTEMS, 2017, 卷号: 11, 期号: 1, 页码: 86-104
作者:  Du, Xiaoning;  Wang, Hong;  Du, Yuhao;  Xu, Li Da;  Chaudhry, Sohail;  Bi, Zhuming;  Guo, Rong;  Huang, Yongxuan;  Li, Jisheng
收藏  |  浏览/下载：67/0  |  提交时间：2019/12/13
Space industry  deep space exploration  industrial information integration engineering  IIIE  SASO model  
PSI Conscious Write Scheduling: Architectural Support for Reliable Power Delivery in 3-D Die-Stacked PCM 期刊论文
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2016, 卷号: 24, 期号: 5, 页码: 1613-1625
作者:  Wang, Ying;  Han, Yinhe;  Li, Huawei;  Zhang, Lei;  Cheng, Yuanqing;  Li, Xiaowei
收藏  |  浏览/下载：56/0  |  提交时间：2019/12/13
3-D integration  IR-drop  phase-change memory (PCM)  through-silicon-via (TSV)  write throughput