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Toward Developing High-Performance RISC-V Processors Using Agile Methodology 期刊论文
IEEE MICRO, 2023, 卷号: 43, 期号: 4, 页码: 98-106
作者:  Xu, Yinan;  Yu, Zihao;  Tang, Dan;  Cai, Ye;  Huan, Dandan;  He, Wei;  Sun, Ninghui;  Bao, Yungang
收藏  |  浏览/下载:15/0  |  提交时间:2023/12/04
Program processors  Behavioral sciences  Chip scale packaging  Microarchitecture  Hardware  Analytical models  Layout  
A Chip-Level Optical Interconnect for CPU 期刊论文
IEEE PHOTONICS TECHNOLOGY LETTERS, 2021, 卷号: 33, 期号: 16, 页码: 852-855
作者:  Hao, Qinfen;  Qin, Mengyuan;  Qi, Nan;  Xue, Haiyun;  Han, Meng;  Li, Xiaolin;  Hao, Kai;  Niu, Xingmao;  Xiao, Limin;  Fan, Dongrui;  Kurata, Kazuhiko
收藏  |  浏览/下载:46/0  |  提交时间:2021/12/01
Integrated optics  Optical interconnections  Transceivers  Adaptive optics  Optical switches  Optical sensors  Power demand  Optical interconnections  digital integrated circuits  very high speed integrated circuits  chip scale packaging  system integration