CSpace

浏览/检索结果: 共77条,第1-10条 帮助

已选(0)清除 条数/页:   排序方式:
DockingGA: enhancing targeted molecule generation using transformer neural network and genetic algorithm with docking simulation 期刊论文
BRIEFINGS IN FUNCTIONAL GENOMICS, 2024, 页码: 12
作者:  Gao, Changnan;  Bao, Wenjie;  Wang, Shuang;  Zheng, Jianyang;  Wang, Lulu;  Ren, Yongqi;  Jiao, Linfang;  Wang, Jianmin;  Wang, Xun
收藏  |  浏览/下载:2/0  |  提交时间:2024/05/20
molecule generation  molecule optimization  drug discovery  deep learning  drug design  genetic algorithm  
Towards connection-scalable RNIC architecture 期刊论文
JOURNAL OF SUPERCOMPUTING, 2024, 页码: 25
作者:  Kang, Ning;  Wang, Zhan;  Yang, Fan;  Ma, Xiaoxiao;  Ma, Zhenlong;  Yuan, Guojun;  Tan, Guangming
收藏  |  浏览/下载:2/0  |  提交时间:2024/05/20
Architecture design  Network Interface Card (NIC)  Remote Direct Memory Access (RDMA)  Scalability problem  
Real-Time Robust Video Object Detection System Against Physical-World Adversarial Attacks 期刊论文
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2024, 卷号: 43, 期号: 1, 页码: 366-379
作者:  Han, Husheng;  Hu, Xing;  Hao, Yifan;  Xu, Kaidi;  Dang, Pucheng;  Wang, Ying;  Zhao, Yongwei;  Du, Zidong;  Guo, Qi;  Wang, Yanzhi;  Zhang, Xishan;  Chen, Tianshi
收藏  |  浏览/下载:3/0  |  提交时间:2024/05/20
Object detection  Streaming media  Optical flow  Feature extraction  Real-time systems  Task analysis  Detectors  Adversarial patch attack  deep learning security  domain-specific accelerator  hardware/software co-design  real time  
JANM-IK: Jacobian Argumented Nelder-Mead Algorithm for Inverse Kinematics and its Hardware Acceleration 期刊论文
IEEE COMPUTER ARCHITECTURE LETTERS, 2024, 卷号: 23, 期号: 1, 页码: 45-48
作者:  Yang, Yuxin;  Chen, Xiaoming;  Han, Yinhe
收藏  |  浏览/下载:2/0  |  提交时间:2024/05/20
Robotics  inverse kinematics  Jacobian  nelder-mead  software-hardware co-design  accelerator  
Chip design with machine learning: a survey from algorithm perspective 期刊论文
SCIENCE CHINA-INFORMATION SCIENCES, 2023, 卷号: 66, 期号: 11, 页码: 31
作者:  He, Wenkai;  Li, Xiaqing;  Song, Xinkai;  Hao, Yifan;  Zhang, Rui;  Du, Zidong;  Chen, Yunji
收藏  |  浏览/下载:7/0  |  提交时间:2023/12/04
chip design  machine learning  chip design automation  design result estimation  design optimization and correction  design construction  
DOE: database offloading engine for accelerating SQL processing 期刊论文
DISTRIBUTED AND PARALLEL DATABASES, 2023, 页码: 25
作者:  Kong, Hao;  Lu, Wenyan;  Chen, Yan;  Wu, Jingya;  Zhang, Yu;  Yan, Guihai;  Li, Xiaowei
收藏  |  浏览/下载:7/0  |  提交时间:2023/12/04
Database  Hardware  software co-design  Heterogeneous system  Analytic query processing  
Scalable and Conflict-Free NTT Hardware Accelerator Design: Methodology, Proof, and Implementation 期刊论文
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2023, 卷号: 42, 期号: 5, 页码: 1504-1517
作者:  Mu, Jianan;  Ren, Yi;  Wang, Wen;  Hu, Yizhong;  Chen, Shuai;  Chang, Chip-Hong;  Fan, Junfeng;  Ye, Jing;  Cao, Yuan;  Li, Huawei;  Li, Xiaowei
收藏  |  浏览/下载:9/0  |  提交时间:2023/12/04
Memory access pattern  number theoretic transform (NTT)  post-quantum cryptography (PQC)  scalable hardware design  
TCADer: A Tightly Coupled Accelerator Design framework for heterogeneous system with hardware/software co-design 期刊论文
JOURNAL OF SYSTEMS ARCHITECTURE, 2023, 卷号: 136, 页码: 12
作者:  Li, Wenqing;  Liu, Tianyi;  Xiao, Ziyuan;  Qi, Han;  Zhu, Weipu;  Wang, Jian
收藏  |  浏览/下载:7/0  |  提交时间:2023/12/04
Heterogeneous system  Tightly coupled  Accelerator design framework  Interaction latency  Low-latency task  
A Framework for Neural Network Architecture and Compile Co-optimization 期刊论文
ACM TRANSACTIONS ON EMBEDDED COMPUTING SYSTEMS, 2023, 卷号: 22, 期号: 1, 页码: 24
作者:  Chen, Weiwei;  Wang, Ying;  Xu, Ying;  Gao, Chengsi;  Liu, Cheng;  Zhang, Lei
收藏  |  浏览/下载:13/0  |  提交时间:2023/07/12
DNN-scheduling Co-design  hardware-aware neural architecture search  compiler optimization  
Chiplet技术发展现状 期刊论文
科技导报, 2023, 卷号: 41, 期号: 19, 页码: 113
作者:  项少林;  郭茂;  蒲菠;  方刘禄;  刘淑娟;  王少勇;  孔宪伟;  郑拓;  赵明;  郝沁汾;  孙凝晖;  刘军
收藏  |  浏览/下载:2/0  |  提交时间:2024/05/20
chiplet technology  chiplet interconnect interfaces  advanced packaging  multi physical field electronic assisted design  signal and power integrity  chiplet技术  芯粒互连接口  先进封装  多物理场电子辅助设计  信号与电源完整性