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Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I 期刊论文
IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 2025, 卷号: 15, 期号: 3, 页码: 362-367
作者:  Hao, Qinfen;  Chen, Kuan-Neng;  Goel, Sandeep Kumar;  Li, Hai;  Marinissen, Erik Jan
收藏  |  浏览/下载:4/0  |  提交时间:2025/12/03
Special issues and sections  Chiplets  Circuits and systems  Electronic design automation and methodology  Packaging  
Toward Efficient Computing for Robotics: From a Circuit and System View 期刊论文
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2022, 卷号: 69, 期号: 7, 页码: 3051-3056
作者:  Xu, Haobo;  Yang, Yuxin;  Min, Feng;  Huang, Junpei;  Chen, Xiaoming;  Han, Yinhe;  Sun, Ninghui
收藏  |  浏览/下载:87/0  |  提交时间:2022/12/07
Robots  Kinematics  Planning  Field programmable gate arrays  Image edge detection  Estimation  Circuits and systems  Robotics  accelerator  hardware  kinematics  motion planning  perception