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Resister: A Resilient Interposer Architecture for Chiplet to Mitigate Timing Side-Channel Attacks 期刊论文
ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS, 2025, 卷号: 30, 期号: 5, 页码: 23
作者:  Wang, Xinrui;  Feng, Lang;  Wang, Yujie;  Xu, Taotao;  Han, Yinhe;  Wang, Zhongfeng
收藏  |  浏览/下载:2/0  |  提交时间:2026/05/25
Chiplet  interposer  timing side-channel attack  mitigate  
FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer 期刊论文
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2024, 页码: 13
作者:  Jiao, Bo;  Xu, Lei;  Yu, Xinyu;  Yang, Haitao;  Zhu, Haozhe;  Wang, Yu;  Zhu, Jundong;  Wen, Dexin;  Wang, Lingli;  Tao, Jun;  Chen, Chixiao;  Han, Yinhe;  Liu, Qi;  Sun, Ninghui;  Liu, Ming
收藏  |  浏览/下载:51/0  |  提交时间:2024/12/06
Chiplet integration  silicon interposer  placement  routing  communication-aware