中国科学院计算技术研究所机构知识库

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	Chiplever: A Hardware-Software Co-Design Framework Toward Extension of Chiplet System for Fully Homomorphic Encryption 期刊论文 IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2026, 卷号: 45, 期号: 2, 页码: 603-616 作者:  Du, Yibo;  Wang, Ying;  Wang, Mengdi;  Li, Xiaowei;  Han, Yinhe 收藏  |  浏览/下载：0/0  |  提交时间：2026/05/25 Hardware  Chiplets  Homomorphic encryption  Polynomials  Vectors  Scheduling algorithms  Noise  Program processors  Design automation  Computational efficiency  Chiplet  fully homomorphic encryption (FHE)  hardware-software co-design  heterogeneous architecture
	Resister: A Resilient Interposer Architecture for Chiplet to Mitigate Timing Side-Channel Attacks 期刊论文 ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS, 2025, 卷号: 30, 期号: 5, 页码: 23 作者:  Wang, Xinrui;  Feng, Lang;  Wang, Yujie;  Xu, Taotao;  Han, Yinhe;  Wang, Zhongfeng 收藏  |  浏览/下载：2/0  |  提交时间：2026/05/25 Chiplet  interposer  timing side-channel attack  mitigate
	FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer 期刊论文 IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2024, 页码: 13 作者:  Jiao, Bo;  Xu, Lei;  Yu, Xinyu;  Yang, Haitao;  Zhu, Haozhe;  Wang, Yu;  Zhu, Jundong;  Wen, Dexin;  Wang, Lingli;  Tao, Jun;  Chen, Chixiao;  Han, Yinhe;  Liu, Qi;  Sun, Ninghui;  Liu, Ming 收藏  |  浏览/下载：51/0  |  提交时间：2024/12/06 Chiplet integration  silicon interposer  placement  routing  communication-aware
	Chiplet技术发展现状 期刊论文 科技导报, 2023, 卷号: 41, 期号: 19, 页码: 113 作者:  项少林;  郭茂;  蒲菠;  方刘禄;  刘淑娟;  王少勇;  孔宪伟;  郑拓;  赵明;  郝沁汾;  孙凝晖;  刘军 收藏  |  浏览/下载：82/0  |  提交时间：2024/05/20 chiplet technology  chiplet interconnect interfaces  advanced packaging  multi physical field electronic assisted design  signal and power integrity  chiplet技术  芯粒互连接口  先进封装  多物理场电子辅助设计  信号与电源完整性