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FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer 期刊论文
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2024, 页码: 13
作者:  Jiao, Bo;  Xu, Lei;  Yu, Xinyu;  Yang, Haitao;  Zhu, Haozhe;  Wang, Yu;  Zhu, Jundong;  Wen, Dexin;  Wang, Lingli;  Tao, Jun;  Chen, Chixiao;  Han, Yinhe;  Liu, Qi;  Sun, Ninghui;  Liu, Ming
收藏  |  浏览/下载：1/0  |  提交时间：2024/12/06
Chiplet integration  silicon interposer  placement  routing  communication-aware