中国科学院计算技术研究所机构知识库

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	FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer 期刊论文 IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2024, 页码: 13 作者:  Jiao, Bo;  Xu, Lei;  Yu, Xinyu;  Yang, Haitao;  Zhu, Haozhe;  Wang, Yu;  Zhu, Jundong;  Wen, Dexin;  Wang, Lingli;  Tao, Jun;  Chen, Chixiao;  Han, Yinhe;  Liu, Qi;  Sun, Ninghui;  Liu, Ming 收藏  |  浏览/下载：1/0  |  提交时间：2024/12/06 Chiplet integration  silicon interposer  placement  routing  communication-aware
	SLAM-CIM: A Visual SLAM Backend Processor With Dynamic-Range-Driven-Skipping Linear-Solving FP-CIM Macros 期刊论文 IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2024, 页码: 13 作者:  Li, Mengjie;  Zhu, Haozhe;  He, Siqi;  Zhang, Hongyi;  Liao, Jie;  Zhai, Danfeng;  Chen, Chixiao;  Liu, Qi;  Zeng, Xiaoyang;  Sun, Ninghui;  Liu, Ming 收藏  |  浏览/下载：3/0  |  提交时间：2024/12/06 Simultaneous localization and mapping  Sorting  In-memory computing  Visualization  Energy efficiency  Optimization  Common Information Model (computing)  Compute in memory (CIM)  floating point (FP)  linear system solver  simultaneous localization and mapping (SLAM)