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FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer 期刊论文
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2024, 页码: 13
作者:  Jiao, Bo;  Xu, Lei;  Yu, Xinyu;  Yang, Haitao;  Zhu, Haozhe;  Wang, Yu;  Zhu, Jundong;  Wen, Dexin;  Wang, Lingli;  Tao, Jun;  Chen, Chixiao;  Han, Yinhe;  Liu, Qi;  Sun, Ninghui;  Liu, Ming
收藏  |  浏览/下载:1/0  |  提交时间:2024/12/06
Chiplet integration  silicon interposer  placement  routing  communication-aware  
Sinusoidal Clock Sampling for Multigigahertz ADCs 期刊论文
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2011, 卷号: 58, 期号: 12, 页码: 2808-2815
作者:  Bai, Rui;  Wang, Jingguang;  Xia, Lingli;  Zhang, Feng;  Yang, Zongren;  Hu, Weiwu;  Chiang, Patrick
收藏  |  浏览/下载:74/0  |  提交时间:2019/12/16
Flash ADC  jitter  SFDR  sinusoidal clock