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FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer 期刊论文
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2024, 页码: 13
作者:  Jiao, Bo;  Xu, Lei;  Yu, Xinyu;  Yang, Haitao;  Zhu, Haozhe;  Wang, Yu;  Zhu, Jundong;  Wen, Dexin;  Wang, Lingli;  Tao, Jun;  Chen, Chixiao;  Han, Yinhe;  Liu, Qi;  Sun, Ninghui;  Liu, Ming
收藏  |  浏览/下载:1/0  |  提交时间:2024/12/06
Chiplet integration  silicon interposer  placement  routing  communication-aware  
The Caenorhabditis elegans intermediate-size transcriptome shows high degree of stage-specific expression 期刊论文
NUCLEIC ACIDS RESEARCH, 2011, 卷号: 39, 期号: 12, 页码: 5203-5214
作者:  Wang, Yunfei;  Chen, Jingjing;  Wei, Guifeng;  He, Housheng;  Zhu, Xiaopeng;  Xiao, Tengfei;  Yuan, Jiao;  Dong, Bo;  He, Shunmin;  Skogerbo, Geir;  Chen, Runsheng
收藏  |  浏览/下载:87/0  |  提交时间:2019/12/16