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DFU-E: A Dataflow Architecture for Edge DSP and AI Applications 期刊论文
IEEE TRANSACTIONS ON PARALLEL AND DISTRIBUTED SYSTEMS, 2025, 卷号: 36, 期号: 6, 页码: 1100-1114
作者:  Li, Wenming;  Fan, Zhihua;  Liu, Tianyu;  Wang, Zhen;  Wu, Haibin;  Wu, Meng;  Zhang, Kunming;  Liu, Yanhuan;  Sun, Ninghui;  Ye, Xiaochun;  Fan, Dongrui
收藏  |  浏览/下载：4/0  |  提交时间：2025/06/25
Artificial intelligence  Hardware  Edge computing  Computer architecture  Computational modeling  Single instruction multiple data  Energy efficiency  Target recognition  Radar polarimetry  Real-time systems  Dataflow architecture  edge computing  digital signal processing  AI  multi-layer dataflow mechanism  
29-Billion Atoms Molecular Dynamics Simulation With Ab Initio Accuracy on 35 Million Cores of New Sunway Supercomputer 期刊论文
IEEE TRANSACTIONS ON COMPUTERS, 2025, 卷号: 74, 期号: 5, 页码: 1634-1648
作者:  Wang, Xun;  Meng, Xiangyu;  Guo, Zhuoqiang;  Li, Mingzhen;  Liu, Lijun;  Li, Mingfan;  Xiao, Qian;  Zhao, Tong;  Sun, Ninghui;  Tan, Guangming;  Jia, Weile
收藏  |  浏览/下载：5/0  |  提交时间：2025/06/25
Atoms  Accuracy  Supercomputers  Optimization  Artificial neural networks  Force  Training  Fitting  Predictive models  Nuclear power generation  High Performance Computing  Molecular Dynamics  DeePMD  Parallel Optimization  New Sunway Supercomputer  
Enhancing crack self-healing properties of low-carbon LC3 cement using microbial induced calcite precipitation technique 期刊论文
FRONTIERS IN MATERIALS, 2024, 卷号: 11, 页码: 14
作者:  Wei, Wenzhu;  He, Qinglong;  Pang, Sen;  Ji, Shengjie;  Cheng, Yiluo;  Sun, Ninghui;  Liang, Yinghao
收藏  |  浏览/下载：2/0  |  提交时间：2025/06/25
limestone calcined clay cement  microbial induced calcite precipitation  Bacillus pasteurii  crack self-healing  compressive strength  low-carbon cementitious materials  
FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer 期刊论文
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2024, 页码: 13
作者:  Jiao, Bo;  Xu, Lei;  Yu, Xinyu;  Yang, Haitao;  Zhu, Haozhe;  Wang, Yu;  Zhu, Jundong;  Wen, Dexin;  Wang, Lingli;  Tao, Jun;  Chen, Chixiao;  Han, Yinhe;  Liu, Qi;  Sun, Ninghui;  Liu, Ming
收藏  |  浏览/下载：18/0  |  提交时间：2024/12/06
Chiplet integration  silicon interposer  placement  routing  communication-aware  
SLAM-CIM: A Visual SLAM Backend Processor With Dynamic-Range-Driven-Skipping Linear-Solving FP-CIM Macros 期刊论文
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2024, 页码: 13
作者:  Li, Mengjie;  Zhu, Haozhe;  He, Siqi;  Zhang, Hongyi;  Liao, Jie;  Zhai, Danfeng;  Chen, Chixiao;  Liu, Qi;  Zeng, Xiaoyang;  Sun, Ninghui;  Liu, Ming
收藏  |  浏览/下载：29/0  |  提交时间：2024/12/06
Simultaneous localization and mapping  Sorting  In-memory computing  Visualization  Energy efficiency  Optimization  Common Information Model (computing)  Compute in memory (CIM)  floating point (FP)  linear system solver  simultaneous localization and mapping (SLAM)  
Improving Utilization of Dataflow Unit for Multi-Batch Processing 期刊论文
ACM TRANSACTIONS ON ARCHITECTURE AND CODE OPTIMIZATION, 2024, 卷号: 21, 期号: 1, 页码: 26
作者:  Fan, Zhihua;  Li, Wenming;  Wang, Zhen;  Yang, Yu;  Ye, Xiaochun;  Fan, Dongrui;  Sun, Ninghui;  An, Xuejun
收藏  |  浏览/下载：33/0  |  提交时间：2024/05/20
Utilization  network-on-chip  decoupled architecture  batch processing  
Accelerating Convolutional Neural Networks by Exploiting the Sparsity of Output Activation 期刊论文
IEEE TRANSACTIONS ON PARALLEL AND DISTRIBUTED SYSTEMS, 2023, 卷号: 34, 期号: 12, 页码: 3253-3265
作者:  Fan, Zhihua;  Li, Wenming;  Wang, Zhen;  Liu, Tianyu;  Wu, Haibin;  Liu, Yanhuan;  Wu, Meng;  Wu, Xinxin;  Ye, Xiaochun;  Fan, Dongrui;  Sun, Ninghui;  An, Xuejun
收藏  |  浏览/下载：28/0  |  提交时间：2024/05/20
Accelerator  output activation  prediction  sparse convolutional neural network  
Toward Developing High-Performance RISC-V Processors Using Agile Methodology 期刊论文
IEEE MICRO, 2023, 卷号: 43, 期号: 4, 页码: 98-106
作者:  Xu, Yinan;  Yu, Zihao;  Tang, Dan;  Cai, Ye;  Huan, Dandan;  He, Wei;  Sun, Ninghui;  Bao, Yungang
收藏  |  浏览/下载：26/0  |  提交时间：2023/12/04
Program processors  Behavioral sciences  Chip scale packaging  Microarchitecture  Hardware  Analytical models  Layout  
Chiplet技术发展现状 期刊论文
科技导报, 2023, 卷号: 41, 期号: 19, 页码: 113
作者:  项少林;  郭茂;  蒲菠;  方刘禄;  刘淑娟;  王少勇;  孔宪伟;  郑拓;  赵明;  郝沁汾;  孙凝晖;  刘军
收藏  |  浏览/下载：36/0  |  提交时间：2024/05/20
chiplet technology  chiplet interconnect interfaces  advanced packaging  multi physical field electronic assisted design  signal and power integrity  chiplet技术  芯粒互连接口  先进封装  多物理场电子辅助设计  信号与电源完整性  
香山开源高性能RISC-V处理器设计与实现 期刊论文
计算机研究与发展, 2023, 卷号: 60, 期号: 3, 页码: 476
作者:  王凯帆;  徐易难;  余子濠;  唐丹;  陈国凯;  陈熙;  勾凌睿;  胡轩;  金越;  李乾若;  李昕;  蔺嘉炜;  刘彤;  刘志刚;  王华强;  王诲喆;  张传奇;  张发旺;  张林隽;  张紫飞;  张梓悦;  赵阳洋;  周耀阳;  邹江瑞;  蔡晔;  郇丹丹;  李祖松;  赵继业;  何伟;  孙凝晖;  包云岗
收藏  |  浏览/下载：56/0  |  提交时间：2024/05/20
RISC-V  high performance processor  open source  chip design  agile development  RISC-V  高性能处理器  开源  芯片设计  敏捷开发