中国科学院计算技术研究所机构知识库

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限定条件	出处：IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择期刊影响因子升序期刊影响因子降序发表日期升序发表日期降序提交时间升序提交时间降序作者升序作者降序WOS被引频次升序WOS被引频次降序题名升序题名降序
	MRFI: An Open-Source Multiresolution Fault Injection Framework for Neural Network Processing 期刊论文 IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2024, 页码: 11 作者:  Huang, Haitong;  Liu, Cheng;  Xue, Xinghua;  Liu, Bo;  Li, Huawei;  Li, Xiaowei 收藏  |  浏览/下载：3/0  |  提交时间：2024/05/20 Biological neural networks  Hardware  Reliability  Computational modeling  Neural networks  Fault tolerant systems  Fault tolerance  Fault evaluation  fault injection  fault simulation  multiresolution  neural network reliability
	Ferroelectric FETs-Based Nonvolatile Logic-in-Memory Circuits 期刊论文 IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2019, 卷号: 27, 期号: 1, 页码: 159-172 作者:  Yin, Xunzhao;  Chen, Xiaoming;  Niemier, Michael;  Hu, Xiaobo Sharon 收藏  |  浏览/下载：81/0  |  提交时间：2019/04/03 Ferroelectric FET (FeFET)  logic-in-memory (LiM)  nonvolatile (NV) memory
	A Flexible Divide-and-Conquer MPSoC Architecture for MIMO Interference Cancellation 期刊论文 IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2017, 卷号: 25, 期号: 10, 页码: 2789-2802 作者:  Yuan, Luechao;  Liu, Cang;  Tang, Chuan;  Huang, Shan;  Chattopadhyay, Anupam;  Ascheid, Gerd;  Xing, Zuocheng 收藏  |  浏览/下载：38/0  |  提交时间：2019/12/12 Interference cancellation (IC)  matrix inversion  multiprocessor system-on-chip(MPSoC)  parallel processing  Tomlinson-Harashimaprecoding(THP)
	Going Cooler With Timing-Constrained TeSHoP: A Temperature Sensing-Based Hotspot-Driven Placement Technique for FPGAs 期刊论文 IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2017, 卷号: 25, 期号: 9, 页码: 2525-2537 作者:  Lu, Weina;  Hu, Yu;  Ye, Jing;  Li, Xiaowei 收藏  |  浏览/下载：39/0  |  提交时间：2019/12/12 Computer-aided design flow  field-programmable gate arrays (FPGAs)  hotspot optimization  performance
	PSI Conscious Write Scheduling: Architectural Support for Reliable Power Delivery in 3-D Die-Stacked PCM 期刊论文 IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2016, 卷号: 24, 期号: 5, 页码: 1613-1625 作者:  Wang, Ying;  Han, Yinhe;  Li, Huawei;  Zhang, Lei;  Cheng, Yuanqing;  Li, Xiaowei 收藏  |  浏览/下载：53/0  |  提交时间：2019/12/13 3-D integration  IR-drop  phase-change memory (PCM)  through-silicon-via (TSV)  write throughput