Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I

doi:10.1109/JETCAS.2025.3600772

	Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I
	Hao, Qinfen 1; Chen, Kuan-Neng 2; Goel, Sandeep Kumar 3; Li, Hai 4; Marinissen, Erik Jan 5
	2025-09-01
发表期刊	IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS
ISSN	2156-3357
卷号	15 期号:3 页码:362-367
关键词	Special issues and sections Chiplets Circuits and systems Electronic design automation and methodology Packaging
DOI	10.1109/JETCAS.2025.3600772
收录类别	SCI
语种	英语
WOS研究方向	Engineering
WOS类目	Engineering, Electrical & Electronic
WOS记录号	WOS:001576681500008
出版者	IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
引用统计
文献类型	期刊论文
条目标识符	http://119.78.100.204/handle/2XEOYT63/41699
专题	中国科学院计算技术研究所期刊论文_英文
通讯作者	Hao, Qinfen
作者单位	1.Chinese Acad Sci, Inst Comp Technol, Beijing 100190, Peoples R China 2.Natl Yang Ming Chiao Tung Univ, Inst Elect, Hsinchu 30010, Taiwan 3.Taiwan Semicond Mfg Co TSMC, San Jose, CA 95124 USA 4.Duke Univ, Elect & Comp Engn Dept, Durham, NC 27708 USA 5.imec, B-3001 Leuven, Belgium
推荐引用方式 GB/T 7714	Hao, Qinfen,Chen, Kuan-Neng,Goel, Sandeep Kumar,et al. Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I[J]. IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS,2025,15(3):362-367.
APA	Hao, Qinfen,Chen, Kuan-Neng,Goel, Sandeep Kumar,Li, Hai,&Marinissen, Erik Jan.(2025).Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I.IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS,15(3),362-367.
MLA	Hao, Qinfen,et al."Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I".IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS 15.3(2025):362-367.