Modeling and Analysis of Thermal Covert Channel Attacks in Many-core Systems

doi:10.1109/TC.2022.3160356

	Modeling and Analysis of Thermal Covert Channel Attacks in Many-core Systems
	Wang, Shengjie 1; Wang, Xiaohang 2,3; Jiang, Yingtao 4; Singh, Amit Kumar 5; Yang, Mei 4; Huang, Letian 6
	2023-02-01
发表期刊	IEEE TRANSACTIONS ON COMPUTERS
ISSN	0018-9340
卷号	72 期号:2 页码:494-500
摘要	In a many-core chip, thermal flux and thermal correlation among the cores can be explored to create a thermal covert channel (TCC). In this paper, we provide an analytical model to quickly determine the key TCC performance metrics, in terms of bit error rate (BER), signal to noise ratio (SNR), and channel capacity, without going through lengthy computer simulation and/or physical experiments that are normally needed in current TCC performance studies. According to our model, the TCC's BER is proportional to the square root of the transmission frequency, which can be explored quantitatively to boost the TCC's transmission efficiency by letting the TCC's thermal signal be transmitted at a higher frequency. In addition, our proposed model also links the jamming noise and application of Dynamic Voltage Frequency Scaling (DVFS) to TCC's BER performance, a feature that can be explored to design/optimize the countermeasures against the TCC attacks. The TCC performance predicted by the proposed theoretical model is found in a good agreement with that obtained from computer simulations, with an average error lower than 7%.
关键词	Computational modeling Receivers Transmitters Encoding Bit error rate Signal to noise ratio Thermal conductivity Many-core systems thermal covert channel analytical model
DOI	10.1109/TC.2022.3160356
收录类别	SCI
语种	英语
资助项目	National Natural Science Foundation of China[61971200] ; Zhejiang Lab[2021LE0AB01] ; Zhejiang Lab[2021PC0AC01] ; Open Research Grant of State Key Laboratory of Computer Architecture Institute of Computing Technology Chinese Academy of Sciences[CARCH201916] ; Key Technologies R&D Program of Jiangsu(Prospective and Key Technologies for Industry)[BE2021003] ; Key Laboratory of Big Data and Intelligent Robot (South China University of Technology) ; Ministry of Education ; National Key Research and Development Program of China u[2019QY0705]
WOS研究方向	Computer Science ; Engineering
WOS类目	Computer Science, Hardware & Architecture ; Engineering, Electrical & Electronic
WOS记录号	WOS:000917782600015
出版者	IEEE COMPUTER SOC
引用统计	被引频次：4[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://119.78.100.204/handle/2XEOYT63/19946
专题	中国科学院计算技术研究所期刊论文
通讯作者	Wang, Xiaohang
作者单位	1.South China Univ Technol, Sch Software Engn, Guangzhou 510006, Guangdong, Peoples R China 2.Zhejiang Lab, Hangzhou 311121, Zhejiang, Peoples R China 3.Chinese Acad Sci, Inst Comp Technol, State Key Lab Comp Architecture, Beijing 100045, Peoples R China 4.Univ Nevada, Dept Elect & Comp Engn, Las Vegas, NV 89154 USA 5.Univ Essex, Sch Comp Sci & Elect Engn, Colchester CO4 3SQ, England 6.Univ Elect Sci & Technol China, Dept Microelect & Solid State Elect, Chenggdu 610054, Sichuan, Peoples R China
推荐引用方式 GB/T 7714	Wang, Shengjie,Wang, Xiaohang,Jiang, Yingtao,et al. Modeling and Analysis of Thermal Covert Channel Attacks in Many-core Systems[J]. IEEE TRANSACTIONS ON COMPUTERS,2023,72(2):494-500.
APA	Wang, Shengjie,Wang, Xiaohang,Jiang, Yingtao,Singh, Amit Kumar,Yang, Mei,&Huang, Letian.(2023).Modeling and Analysis of Thermal Covert Channel Attacks in Many-core Systems.IEEE TRANSACTIONS ON COMPUTERS,72(2),494-500.
MLA	Wang, Shengjie,et al."Modeling and Analysis of Thermal Covert Channel Attacks in Many-core Systems".IEEE TRANSACTIONS ON COMPUTERS 72.2(2023):494-500.