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Physical feature-based machine learning of BEOL thermal conductivity in 3D ICs 期刊论文
MICROELECTRONICS JOURNAL, 2026, 卷号: 168, 页码: 11
作者:  Liu, Yunting;  Fu, Rong;  Zhu, Jixiang;  Zhang, Kun;  Chen, Chuan;  Li, Jun;  Cao, Liqiang
收藏  |  浏览/下载:2/0  |  提交时间:2026/05/25
3D integrated circuits  Advanced back-end-of-line interconnects  Anisotropic thermal conductivity  Thermal management  
Modeling and Analysis of Thermal Covert Channel Attacks in Many-core Systems 期刊论文
IEEE TRANSACTIONS ON COMPUTERS, 2023, 卷号: 72, 期号: 2, 页码: 494-500
作者:  Wang, Shengjie;  Wang, Xiaohang;  Jiang, Yingtao;  Singh, Amit Kumar;  Yang, Mei;  Huang, Letian
收藏  |  浏览/下载:78/0  |  提交时间:2023/07/12
Computational modeling  Receivers  Transmitters  Encoding  Bit error rate  Signal to noise ratio  Thermal conductivity  Many-core systems  thermal covert channel  analytical model