中国科学院计算技术研究所机构知识库

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	Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I 期刊论文 IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 2025, 卷号: 15, 期号: 3, 页码: 362-367 作者:  Hao, Qinfen;  Chen, Kuan-Neng;  Goel, Sandeep Kumar;  Li, Hai;  Marinissen, Erik Jan 收藏  |  浏览/下载：4/0  |  提交时间：2025/12/03 Special issues and sections  Chiplets  Circuits and systems  Electronic design automation and methodology  Packaging
	Guest Editorial: When Multimedia Meets Food: Multimedia Computing for Food Data Analysis and Applications 期刊论文 IEEE TRANSACTIONS ON MULTIMEDIA, 2025, 卷号: 27, 页码: 2708-2712 作者:  Min, Weiqing;  Jiang, Shuqiang;  Radeva, Petia;  Pavlovic, Vladimir;  Ngo, Chong-Wah;  Aizawa, Kiyoharu;  Li, Wanqing 收藏  |  浏览/下载：3/0  |  提交时间：2025/12/03 Special issues and sections  Food products  Data analysis  Multimedia computing
	Urban Multimedia Computing: Emerging Methods in Multimedia Computing for Urban Data Analysis and Applications Guest Editors' Introduction 期刊论文 IEEE MULTIMEDIA, 2020, 卷号: 27, 期号: 3, 页码: 8-11 作者:  Min, Weiqing;  Tian, Yonghong;  Huang, Zi;  Cheng, Wen-Huang;  El Saddik, Abdulmotaleb 收藏  |  浏览/下载：79/0  |  提交时间：2020/12/10 Special issues and sections  Multimedia computing  Multimedia communication  Feature extraction  Urban areas  Generative adversarial networks