中国科学院计算技术研究所机构知识库

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	Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I 期刊论文 IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 2025, 卷号: 15, 期号: 3, 页码: 362-367 作者:  Hao, Qinfen;  Chen, Kuan-Neng;  Goel, Sandeep Kumar;  Li, Hai;  Marinissen, Erik Jan 收藏  |  浏览/下载：4/0  |  提交时间：2025/12/03 Special issues and sections  Chiplets  Circuits and systems  Electronic design automation and methodology  Packaging
	Joint Design of Training and Hardware Towards Efficient and Accuracy-Scalable Neural Network Inference 期刊论文 IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 2018, 卷号: 8, 期号: 4, 页码: 810-821 作者:  He, Xin;  Lu, Wenyan;  Yan, Guihai;  Zhang, Xuan 收藏  |  浏览/下载：280/0  |  提交时间：2019/04/03 Approximate computing  neural network accelerator  hardware-oriented training  sensitivity analysis  energy efficient architecture  near threshold voltage  approximate multiplier