Institute of Computing Technology, Chinese Academy IR
分面浏览:资助项目 |
当前检索式 | ((ALL:Chip scale packaging)) |
限定条件 | ((出处:IEEE MICRO) AND (作者:He, Wei) AND (作者:Huan, Dandan) AND (发表日期:2023) AND (语种:英语) AND (资助项目:Institute of Computing Technology (ICT) Innovation Grant[E261100])) |