Microarchitecture of the Godson-2 processor

	Microarchitecture of the Godson-2 processor
	Hu, WW; Zhang, FX; Li, ZS
	2005-03-01
发表期刊	JOURNAL OF COMPUTER SCIENCE AND TECHNOLOGY
ISSN	1000-9000
卷号	20 期号:2 页码:243-249
摘要	The Godson project is the first attempt to design high performance general-purpose microprocessors in China. This paper introduces the microarchitecture of the Godson-2 processor which is a 64-bit, 4-issue, out-of-order execution RISC processor that implements the 64-bit MIPS-like instruction set. The adoption of the aggressive out-of-order execution techniques (such as register mapping, branch prediction, and dynamic scheduling) and cache techniques (such as non-blocking cache, load speculation, dynamic memory disambiguation) helps the Godson-2 processor to achieve high performance even at not so high frequency. The Godson-2 processor has been physically implemented on a 6-metal 0.18 mu m CMOS technology based on the automatic placing and routing flow with the help of some crafted library cells and macros. The area of the chip is 6,700 micrometers by 6,200 micrometers and the clock cycle at typical corner is 2.3 ns.
关键词	superscalar pipeline out-of-order execution branch prediction register renaming dynamic scheduling non-blocking cache load speculation
收录类别	SCI
语种	英语
WOS研究方向	Computer Science
WOS类目	Computer Science, Hardware & Architecture ; Computer Science, Software Engineering
WOS记录号	WOS:000227919000013
出版者	SCIENCE CHINA PRESS
引用统计	被引频次：31[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://119.78.100.204/handle/2XEOYT63/10181
专题	中国科学院计算技术研究所期刊论文_英文
通讯作者	Hu, WW
作者单位	Chinese Acad Sci, Comp Technol Inst, Beijing 100080, Peoples R China
推荐引用方式 GB/T 7714	Hu, WW,Zhang, FX,Li, ZS. Microarchitecture of the Godson-2 processor[J]. JOURNAL OF COMPUTER SCIENCE AND TECHNOLOGY,2005,20(2):243-249.
APA	Hu, WW,Zhang, FX,&Li, ZS.(2005).Microarchitecture of the Godson-2 processor.JOURNAL OF COMPUTER SCIENCE AND TECHNOLOGY,20(2),243-249.
MLA	Hu, WW,et al."Microarchitecture of the Godson-2 processor".JOURNAL OF COMPUTER SCIENCE AND TECHNOLOGY 20.2(2005):243-249.